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 Product No. DynaMAP Textbook Price: FREE with membership

Dynamic College Algebra : Chapter 1 : Measurement / Data Analysis

Marsha Davis, Gary Froelich and Gary Simundza

 Mathematics Topic:Algebra Application Areas:College Algebra Prerequisites:Software Wafer Thickness Control Chart Excel

| ©2011 by COMAP, Inc. | DynaMap | 136 pages |

Dynamic College Algebra

Dynamic College Algebra uses a modeling approach built around applications from technical fields such as semiconductor manufacturing and biotechnology. Each chapter begins with an engaging contextual problem that students explore in class or on their own via an Adobe Air simulation. Reflecting the realities of modern technical careers, Dynamic College Algebra integrates data analysis and spreadsheet technology throughout.

Chapter 1: Measurement/Data Analysis
Chapter 2: Variation
Chapter 3: Introduction to Functions
Chapter 4: Linear Relationships
Chapter 5: Systems of Equations
Chapter 6: Exponential and Logarithmic Functions
Chapter 7: Polynomial Functions
Chapter 8: Trigonometric Functions

CHAPTER 1: Measurement/Data Analysis

This chapter introduces students to some basic techniques in data analysis. A pervading theme in this chapter is the use of statistical analysis for quality control. In the course of completing this chapter, students organize data into frequency tables and use histograms and dot plots to display the data. They describe the shape of the data and use statistics to describe the data’s location and spread. The first “model” introduced is the use of density curves to describe various shapes of data with the major focus on the normal density curve. All of this background information leads up to a discussion of control charts (run charts and x-bar charts) in the last section of the chapter.

Career Features

Introductory Activity

Introduction to Data Analysis

Section 1.1, Distributions and the Shape of Data

Section 1.2, Describing Distributions with Numbers

Section 1.3, The Normal Distribution

Section 1.4, Control

Charts

Review
Chapter 1 Review 1

Instructor’s Notes
Answers

Chapter 1: Software:

Wafer Thickness

The Wafer Thickness software allows you to set three controls that adjust the grinding and polishing processes. Each control has three levels. After setting the controls, you can take a sample of polished wafers and measure their thicknesses.

Control Chart

Use the Control Chart software to collect samples of data over time and plot the sample means to create an x chart. After each new sample mean is plotted, students decide whether the process is in control and can continue or is out of control and needs to be stopped.

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